Numerical Study of a Double Layered Microchannel Heat Sink Cooled by Hybrid Nanofluids

Over the past decades electronic circuit’s components have become more powerful and smaller in size to fulfil today’s demand for powerful devices with smaller and thinner size, which directly affects the heat flux generation where large amount of heat is produced within a short duration of time. A compacted cooling system is required to be devoted to cool down any electronic system or chip efficiently. In this study various parameters have been studied to design a double layered microchannel heat sink with the highest possible thermal efficiency. This study is a modification of an experimental study recommended earlier by numerous literatures. Forced convection heat transfer through a double layered microchannel heat sink has been theoretically studied using computational fluid dynamic method by ANSYS-fluent 2021 R2 software, focusing the study on geometry, coolant, heat sink material and type of fluid flow parameters. A new double layered microchannel heat sink (DL-MCHS) design is proposed with counter fluid flow condition and employing Al2O3-SiO2/H2O hybrid nanofluid with (%4) volume concertation, along with a copper substrate material for the heat sink body. The results showed that this design enhanced the thermal efficiency about (77.8%) as compared to the original experimental work under the exact same boundary conditions. Also, the differences in hybrid nanofluids thermophysical properties correlations were explored as there is two different classes of correlation that have different equation elements. The result of this comparison illustrated that nanoparticle size is an effective component in thermal conductivity and dynamic viscosity correlations, which helps develop better thermal properties and obtained lower resistance. Therefore, it should not be neglected, as smaller particle size improves the performance of the coolant.